PADS中多逻辑系列意思是：ANA BGA ball grid array 球栅阵列封装BPF BQF CAP CAPACITOR 电容器CFP CFP 陶瓷扁平封装CLC CMO CON CONIN 连接器CQF DIO DIODE 二极管DIP Dual In-line Package 双列直插式组件ECL EDG FUS FUSE 保险丝HMO HOL IND INDUCTANCE 电感LCC Leadless chip carrier 无引脚片式载体MOS Metal Oxide Semiconductor 金属氧化物半导体OSC Open Source Commerce 振荡器PFP PGA butt joint pin grid array 碰焊(pin grid array) PLC POT POTENTIOMETER 可变电阻器PQF PSO QFJ CLCC(ceramic leaded chip carrier)也称QFJ,QFJ-G QFP quad flat package 四侧引脚扁平封装QSO RES Resistor 电阻器 RLY RLY 继电器SCR Silicon Controlled Rectifier 可控硅SKT SOI small out-line I-leaded package I形引脚小外型封装SOJ Small Out-Line J-Leaded Package J形引脚小外型封装SOP small Out-Line package 小外形封装SSO SWI SWITCH 开关TQF TRX Transistor 三极管TSO TTL Transistor-Transistor Logic BJT-BJT 逻辑门VSO XFR XFMR 变压器ZEN ZENER 齐纳二极管UND 增加SIP single in-line package 直插式组件photoelectric coupler 光电耦合器LED Light Emitting Diode 发光二极管TVS Transient Voltage Suppressor 瞬态电压抑制二极管)FB Ferrite bead 磁珠TP TEST POINT 测试点MIC MICROPHONE 麦克风BQFP BQFP(quad flat package with bumper 带缓冲垫的四侧引脚扁平封装CLCC ceramic leaded chip carrier 带引脚的陶瓷芯片载体COB chip on board 板上芯片封装DFP dual flat package 双侧引脚扁平封装,是SOP 的别称FP flat package 扁平封装FQFP fine pitch quad flat package 小引脚中心距QFP CQFP quad fiat package with guard ring 带保护环的四侧引脚扁平封装)HSOP H-(with heat sink)HSOP 表示带散热器的SOP LQFP low profile quad flat package 薄型QFP SMD surface mount devices 表面贴装器件CPGA Ceramic Pin Grid Array ZIP Zig-Zag Inline Package 之字型直插式封装